Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment
US11407202B2 · kind B2 · utility
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3References
10Claims
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Key dates
| Filing date | Aug 5, 2019 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Aug 5, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12924
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.