Polishing compositions for reduced defectivity and methods of using the same
US11407923B2 · kind B2 · utility
1Cited by
1References
29Claims
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Key dates
| Filing date | Jan 29, 2021 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 μm bin size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.