High intensity discharge light assembly
US11408602B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2021 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jul 23, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light assembly includes a heat pipe having a first condenser portion and a first evaporator portion. The heat pipe has a longitudinally extending wall. A plurality of light sources is disposed at least partially around and thermally coupled to longitudinally extending wall at the first evaporator portion of the heat pipe. A heat sink housing has a heat sink portion, an electronic housing portion and a plurality of fins. The heat sink housing receives the first condenser portion of the heat pipe. The heat sink housing separated from the electronic housing portion by a wall. The electronic defines a drive circuit volume comprising a drive circuit and temperature sensor. The drive circuit reduces current to the light sources in response to the temperature signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.