Measuring system and method
US11408729B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2018 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jan 26, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The disclosure provides a metrology system, comprising: a lens assembly configured to receive reflected light from a sample surface and split the reflected light into at least a first reflected beam and a second reflected beam; an imaging unit configured to receive the first reflected beam to generate imaging data of the sample surface, wherein the imaging data includes distribution information of at least one detection area located in at least one detection region of the sample; a film thickness measuring unit configured to receive the second reflected beam, and obtain film thickness data of a specified object in the detection area; and a processing unit, communicatively coupled to the imaging unit and the film thickness measuring unit, and configured to: determine a detection path of the at least one detection area based on the distribution information, and cause the film thickness measuring unit to obtain film thickness data of the detection area based on the detection path, wherein, on an optical path, spectrum receiving surface of the imaging unit is configured to be optically conjugate with the sample surface, and a spectrum receiving surface of the film thickness measuring u…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.