Thermal sensor package for earbuds
US11408781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | May 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.