Electronic component for emitting and receiving radar signals

US11408974B2 · kind B2 · utility

Assignee

• Endress+Hauser SE+Co. KG · DE

Inventors

• Winfried Mayer · Hobrechtsfelde, DE
• Martin Hitzler · Dillingen/Saar, DE

Key dates

• Filing date: May 9, 2018
• Grant date: Aug 9, 2022
• Expiry date: Mar 4, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q9/0407
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates to an electronic component for the bunched emitting and/or receiving of radar signals. For this, the electronic component comprises: a semiconductor chip, which is embodied to emit and/or to receive the radar signal by means of a primary radiator, and a support, on whose surface the semiconductor chip is arranged for electrical contacting. According to the present disclosure, the surface of the support has at least a first step embodied in such a manner that the radar signal in the case of the emitting and/or receiving is bunched approximately perpendicularly to the surface of the support. In this way, the electronic component-of the present disclosure is suited especially for those applications of radar based distance measurement, which benefit from bunched emitted and received radar signals.