Patent · US Active

Shape memory alloy wire attachment structures with adhesive for a suspension assembly

US11409070B2 · kind B2 · utility

3Cited by

42References

50Claims

0Family size

Assignee

Hutchinson Technology Incorporated · US

Inventors

Bryan J. Scheele · Hutchinson, US
Dean E. Myers · Stewart, US
Michael W. Davis · Elburn, US
Erich W. Bierbrauer · Hutchinson, US
Mark A. Miller · Hutchinson, US

Key dates

Filing date	Jun 9, 2017
Grant date	Aug 9, 2022
Priority date	—
Expiry date	Nov 5, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG02B27/646
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. According to various embodiments, the attachment structures include at least one of: an adhesive disposed proximate to a side of the attachment structures and between the attachment structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.