Head-mounted heat dissipation device
US11409344B1 · kind B1 · utility
1Cited by
12References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 20, 2022 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jan 20, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0161
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A head-mounted heat dissipation device includes a fan assembly and a wearing assembly. The wearing assembly is connected to the fan assembly to fix the fan assembly onto a head of a user. The fan assembly includes a casing and fans arranged in the casing. Air inlets and air outlets are defined in the casing. The air outlets are located on an inner side of the bottom surface of the casing, so that the air from the air outlets can be blown to the user's face. In addition, air guide strips are arranged side by side on a side of the air outlet within the casing for concealing the operation of the fans.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.