Method of filling a slit in a metallic smartcard
US11410013B2 · kind B2 · utility
0Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Sep 28, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2425/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for filling a through slit in a metal layer for use in a metallic smartcard by providing a metal sheet having at least one through slit extending through the thickness of the metal sheet, applying a polymer resin to the metal sheet so as to substantially fill the slit(s), and curing the resin. A coupling frame for a smartcard, and a smartcard are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.