Fan-out electronic device

US11410875B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Hau Nguyen · San Jose, US
• Woochan Kim · Seoul, KR
• Yi Yan · Taipei, TW
• Luu Thanh Nguyen · San Jose, US
• Ashok S. Prabhu · San Jose, US
• Anindya Poddar · Sunnyvale, US
• Masamitsu Matsuura · Beppu, JP
• Kengo Aoya · Beppu, JP
• Mutsumi Masumoto · Beppu, JP

Key dates

• Filing date: Dec 19, 2018
• Grant date: Aug 9, 2022
• Expiry date: Dec 19, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/157
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).