Semiconductor module
US11410911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2018 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Aug 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module includes a base configuring a multiple of terminals or wires, a semiconductor switching element mounted on a mounting portion of the terminal, and a molded resin that seals the semiconductor switching element, wherein a wide portion having a width greater than that of the terminal or the wire is formed in one portion of the terminal or the wire in an outer peripheral side end portion of the molded resin, and the wide portion is embedded and fixed in an interior of the molded resin in a state extended toward the interior from the outer peripheral side end portion of the molded resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.