Semiconductor devices
US11410997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jul 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include a substrate including first regions and a second region between the first regions. Active fins may protrude from the substrate in the first regions. Each of the active fins may extend in a first direction parallel to an upper surface of the substrate. The active fins may be regularly arranged and spaced apart from each other in a second direction. First trenches may be at both edges of the second region. A protrusion may be between the first trenches. An upper surface of the protrusion may be lower than a bottom of the active fins. A first width in the second direction of one of the first trenches may be greater than 0.7 times a first pitch of the active fins that is a sum of a width of one of the active fins and a distance between adjacent ones of the active fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.