Sensor chip and electronic device
US11411032B2 · kind B2 · utility
1Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | May 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
Abstract
An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.