Methods for fabricating mechanically stacked multicolor focal plane arrays and detection devices
US11411040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Dec 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
Methods of fabricating multicolor, stacked detector devices and focal plane arrays are disclosed. In one embodiment, a method of fabricating a stacked multicolor device includes forming a first detector by depositing a first detector structure on a first detector substrate, and depositing a first ground plane on the first detector structure, wherein the first ground plane is transmissive to radiation in a predetermined spectral band. The method further includes bonding an optical carrier wafer to the first ground plane, removing the first detector substrate, and forming a second detector. The second detector is formed by depositing a second detector structure on a second detector substrate, and depositing a second ground plane on the second detector structure. The method further includes depositing a dielectric layer on one of the first detector structure and the second ground plane, bonding the first detector to the second detector, and removing the second detector substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.