Multi-sided thermal management device for electronic apparatus
US11411153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Dec 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED device includes a multi-sided heat spreader element with a longitudinal multi-sided wall at least partly enclosing an internal space, with a plurality of LEDs mounted to the outer surface the heat spreader element, and a flow space for a cooling medium in the internal space. The tubular heat spreader element has at least one layer of a thermally conductive metal which is bendable from a flat shape to the multi-sided shape. The multi-sided shape may be tubular with a smoothly curved or multi-faceted polygonal wall. The wall of the LED device may incorporate two-phase cooling elements such as vapor chambers to maintain the LEDs at a constant temperature, and may include a temperature-controlled fan unit to control the LED temperature, and also control the wavelength and frequency of light emitted by the LEDs. A method for manufacturing the LED device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.