Offset embedded ground plane cutout
US11411158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jan 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/815
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques for creating an offset embedded ground plane cutout for a qubit device to facilitate frequency tuning of the qubit device are presented. A qubit device can comprise a first substrate and second substrate in a flip-chip assembly. The qubit chip assembly can comprise a qubit component fabricated on the first substrate. The qubit component can comprise a Josephson junction (JJ) circuit that can be offset from a center point of the qubit component. The qubit chip assembly can comprise an embedded ground plane situated on a surface of the qubit chip assembly. A cutout section can be formed in the ground plane and positioned over the JJ circuit. The cutout section can enable access of an optical signal or magnetic flux to the JJ circuit. A frequency of the qubit component can be tuned based on application of the optical signal or magnetic flux to the JJ circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.