Packaging for ultrasonic transducers
US11411163B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2016 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | May 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/883
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.