Three-dimensional image reconstruction using multi-layer data acquisition
US11412204B2 · kind B2 · utility
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Key dates
| Filing date | Apr 14, 2021 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N13/398
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera, including: two imaging systems each comprising a different optical path corresponding to a different viewing angle of an object; one or more illumination sources; a mask disposed with multiple pairs of apertures, wherein each aperture of each aperture pair corresponds to a different one of the imaging systems; at least one detector configured to acquire multiple image pairs of the object from the two imaging systems via the multiple pairs of apertures; and a processor configured to produce from the multiple acquired image pairs a multi-layer three dimensional reconstruction of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.