Component carrier and method of manufacturing the same
US11412618B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Dec 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.