Process for manufacturing a roll of flexible carrier for electronic components
US11412620B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jun 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10984
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.