Device-embedded board and method of manufacturing the same
US11412621B2 · kind B2 · utility
1Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Mar 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/015
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.