Cooling for server with high-power CPU
US11412638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Dec 3, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.