Component-mounting device
US11412648B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Sep 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0813
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.