Soft sensor-embedded glove and method for manufacturing same
US11412793B2 · kind B2 · utility
2Cited by
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6Claims
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Key dates
| Filing date | Nov 23, 2020 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/016
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
Provided is a soft sensor embedded glove including an upper inside skin pattern, a soft sensor module coupled to at least a surface of the upper inside skin pattern, and including at least one soft sensor formed on a joint portion of a finger to measure flexion and extension of the finger, and an outside skin coupled to the upper inside skin pattern and exposed to outside, wherein, in the upper inside skin pattern, a width of a region to which the at least one soft sensor is coupled is less than a width of another region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.