Silver powder mixture, method for producing same, and conductive paste
US11413685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Nov 14, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 μm or more and 50 μm or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.