Gas sensor module and method of manufacturing gas sensor module
US11415536B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95001
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.