Component communications in system-in-package systems
US11416050B2 · kind B2 · utility
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15References
23Claims
0Family size
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Key dates
| Filing date | May 8, 2017 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2879
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.