Patent · US Active

Method and device for determining a feature for devices produced on a wafer

US11417552B2 · kind B2 · utility

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14Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Christoph Zimmer · Strohberg, DE
Dusan Radovic · Stuttgart, DE
Eric Sebastian Schmidt · Marian, AU
Matthias Kuehnel · Hessenhöfe, DE
Michael Herman · Sindelfingen, DE
Wenqing Liu · Longbeilingcun, CN
Jan Martin Lubisch · Röttgen, DE

Key dates

Filing date	Aug 25, 2020
Grant date	Aug 16, 2022
Priority date	—
Expiry date	Jan 19, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG06F2101/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A computer-implemented method for inferring a device feature of a device produced on a wafer. The method includes: providing a wafer feature model associating a wafer position indicating a position of a produced device on the wafer to a device feature, wherein the wafer feature model is configured to be trained by one or more wafer feature maps and particularly configured as a Gaussian process model, providing a sample device feature of at least one device at a sample wafer position, and inferring the device feature of at least one other device of the wafer depending on the provided wafer feature model.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.