Electronic device having supporting resin and manufacturing method thereof
US11417624B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes: a first resin layer having a first resin layer main surface and a first resin layer inner surface; a columnar conductor having a columnar conductor main surface and a columnar conductor inner surface and penetrating the first resin layer in direction z; a wiring layer connecting the first resin layer main surface and the first conductor main surface; an electronic component being electrically connected and joined to the wiring layer; a second resin layer having a second resin layer main surface facing the same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface, covering the wiring layer and the electronic component; and an external electrode closer to the side where the first resin layer inner surface faces than the first resin layer and is electrically connected to the columnar conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.