Method of forming protective film on at least one electronic module
US11419221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2019 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.