Brittle object cutting apparatus and cutting method thereof
US11420894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2017 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Nov 13, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.