Heat spreader and method of manufacture thereof
US11421139B2 · kind B2 · utility
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11Claims
0Family size
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Key dates
| Filing date | May 28, 2018 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jan 30, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat spreader. The heat spreader includes a copper substrate layer, and at least one layer of graphene deposited on the copper substrate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.