Optical communication module manufacturable other than in a vacuum and method of manufacture thereof
US11422323B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Dec 21, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4286
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical communication module made with transparent packaging material which locates elements and provides protection against contaminants and EMI includes a printed circuit board; a photoelectric element disposed on the printed circuit board; an optical-fiber connector disposed on the printed circuit board, corresponding to the photoelectric element; the transparent packaging material covers the printed circuit board, the photoelectric component and the optical-fiber connector. An electromagnetic shielding layer covers the transparent packaging material. A method of manufacturing same is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.