Method of producing stacking structure, stacking structure and touch sensor
US11422647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Sep 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a stacking structure includes providing a substrate; printing, by flexography, a catalyst layer onto the substrate, wherein the catalyst layer includes a grid pattern and a conducting wire pattern connected to the grid pattern; plating, by chemical plating, a metal layer onto the catalyst layer, wherein the metal layer includes a metal grid corresponding in position to the grid pattern of the catalyst layer and a metal conducting wire corresponding in position to the conducting wire pattern of the catalyst layer; and printing, by flexography, a silver nanowire layer onto the metal layer, wherein the silver nanowire layer at least partially overlaps the metal grid. A stacking structure includes a substrate; a catalyst layer; a metal layer; and a silver nanowire layer. The method of producing a stacking structure and the stacking structure are applicable to a touch sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.