Polishing compositions and methods of using same
US11424131B2 · kind B2 · utility
1Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jul 15, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid and a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion and a hydrophilic portion; in which the hydrophobic portion includes a C16 to C22 hydrocarbon group and the hydrophilic portion comprises at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group. The polishing composition has a pH of about 2 to about 6.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.