Method of manufacturing structure
US11424157B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Oct 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a structure that includes a substrate provided with a through hole, and a resin layer provided on a front surface of the substrate to close the through hole, includes, in order, preparing the substrate including the through hole and including a support substrate on a back surface of the substrate to close the through hole, bonding a dry film to a front surface of the substrate, the dry film including a support member and a resin layer on the support member, to close the through hole with the resin layer and turn the through hole into a closed space with the substrate, the support substrate, and the dry film, opening the through hole turned into the closed space from the support substrate side, and separating the support member from the dry film while retaining the resin layer on the front surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.