Three-dimensional electronic device through organic solvent plasticization process of polymer frame, and method for manufacturing same
US11424163B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Mar 14, 2019 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/113
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a three-dimensional electronic device manufactured through a polymer frame solvent-plasticizing process and a method for manufacturing the three-dimensional electronic device including a polymer frame configured to have a planar figure-like shape so as to have a polygonal bottom and adjacent surfaces which are formed to be extended from respective edges of the bottom; and a flexible electronic device which is transferred to the polymer frame. The polymer frame is exposed to organic solvent vapor and has a change in Young's modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.