LED lighting arrangement
US11424223B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 2019 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Aug 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.