Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells

US11424373B2 · kind B2 · utility

Assignees

• SUNPOWER CORPORATION · US
• TOTAL MARKETING SERVICES · FR

Inventors

• Richard Hamilton Sewell · Los Altos, US
• Gabriel Harley · Mountain View, US
• Nils-Peter Harder · San Jose, US

Key dates

• Filing date: Apr 1, 2016
• Grant date: Aug 23, 2022
• Expiry date: Sep 12, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50

Abstract

Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.