Universal bone conduction and middle ear implant
US11425514B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Sep 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A middle ear implant system includes a bone conduction transducer configured for fixed attachment to skull bone of a patient beneath the skin behind the ear, and for generating sound vibrations from an external communications signal received through the skin for coupling to the skull bone for bone conduction sound perception by the patient. A malleable ossicle connector is connected to the bone conduction transducer and a middle ear hearing structure of the patient. And one or more isolation springs are configured for placement at the fixed attachment of the bone conduction transducer to the skull bone to acoustically decouple the bone conduction transducer from the skull bone to avoid bone conduction sound perception so that sound perception from the external communications signal is solely via the middle ear sound perception from vibrations coupled to the middle ear hearing structure by the ossicle connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.