Thermal design of an access point
US11425842B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Sep 14, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus is disclosed for cooling an electronic device, the apparatus including a conductive mounting bracket to couple with an electronic device housing and a heat sink integrated with the conductive mounting bracket. The cooling apparatus further includes a heat pipe coupled with the conductive mounting bracket on a first side of the heat pipe, the heat pipe to be directly coupled with a targeted electronic component within the electronic device, on a second side of the heat pipe. The apparatus may further include a conductive mounting interface attached to the electronic device housing to attach to the conductive mounting bracket. A mounting receptacle deployed within the conductive mounting interface may be used to expose the targeted electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.