Closed-loop adjustment system and method for gap control and leveling of ultrasonic devices
US11426992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2019 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Mar 29, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2310/028
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.