Apparatus for electro-chemical plating
US11427924B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2021 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.