Wafer supporting mechanism, chemical vapor deposition apparatus, and epitaxial wafer manufacturing method
US11427929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2016 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Aug 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer supporting mechanism including: a wafer supporting table; and a movable part supported by the wafer supporting table, wherein the wafer supporting table includes a wafer supporting portion for transfer that stands up from a first surface opposing a back surface of a wafer to be placed and is provided further toward an inner side than an outer peripheral edge of the wafer to be placed, and the movable part includes a wafer supporting portion for film formation that is positioned further toward an outer peripheral side of the wafer to be placed than the wafer supporting portion for transfer and is relatively movable with respect to the wafer supporting table in a standing direction of the wafer supporting portion for transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.