Patent · US Active

Meshless method for solid mechanics simulation, electronic device, and storage medium

US11429765B2 · kind B2 · utility

0Cited by

0References

17Claims

0Family size

Assignee

Beihang University · CN

Inventors

Leiting Dong · Beijing, CN
Tian Yang · 红钢城街道, CN

Key dates

Filing date	Jul 10, 2020
Grant date	Aug 30, 2022
Priority date	—
Expiry date	Dec 3, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG06F2119/02
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A meshless method for solid mechanics simulation, which includes the following steps: first constructing a trial function and a test function by distributing points according to a geometric shape of a structure; then introducing numerical flux to correct the traditional Galerkin weak form; and finally substituting the trial and test functions into the weak form to construct a global stiffness matrix of the structure and a system of algebraic equations, and solving the system of algebraic equations to obtain displacement and stress of each point, thus completing simulation and analysis of the structure deformation and stress.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.