Semiconductor device
US11430709B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2021 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided, including multiple memory chips and a temperature detection module. The temperature detection circuit includes: multiple temperature sensitive units, arranged on the memory chips to detect temperatures of the memory chips; and a processing unit. The multiple temperature sensitive units share the processing unit with each other. The processing unit is configured to process a signal of at least one of the temperature sensitive units. The processing unit includes a calibration value memory cell and a calibration unit. The calibration value memory cell is configured to store a calibration value corresponding to the temperature sensitive unit. The calibration unit is configured to calibrate the temperature sensitive unit according to the calibration value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.