Methods for attaching large components in a package substrate for advanced power delivery
US11432405B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Jun 29, 2018 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Dec 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package substrate is disclosed. The package substrate includes a substrate core, a cavity below the substrate core that extends from a surface of a first resist layer to a bottom surface of the package substrate, and a first terminal and a second terminal in the first resist layer. The package substrate also includes one or more passive components that are coupled inside the cavity to the first terminal and the second terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.