Patent · US Active

Curable composition for making cured layer with high thermal stability

US11434313B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Canon Kabushiki Kaisha · JP

Inventors

Fei Li · Austin, US
Timothy Brian Stachowiak · Austin, US
Fen Wan · Austin, US
Weijun Liu · Cedar Park, US

Key dates

Filing date	Dec 16, 2020
Grant date	Sep 6, 2022
Priority date	—
Expiry date	Dec 16, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08F2800/20
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.