Temperature sensing device of integrated circuit
US11435237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Oct 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/34
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.