Wafer scale bonded active photonics interposer

US11435523B2 · kind B2 · utility

Assignee

• The Research Foundation for The State University of New York · US

Inventors

• Douglas D. Coolbaugh · Highland, US
• Douglas C. La Tulipe, Jr. · Albany, US
• Gerald L. Leake · Albany, US

Key dates

• Filing date: Jun 23, 2020
• Grant date: Sep 6, 2022
• Expiry date: Jun 23, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/201
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

There is set forth herein an optoelectrical system comprising: a conductive path for supplying an input voltage to a photonics device, wherein the conductive path comprises a base structure through via extending through a substrate and a photonics structure through via, the photonics structure through via extending through a photonics device dielectric stack. There is set forth herein an optoelectrical system comprising: a second structure fusion bonded to an interposer base dielectric stack of a first structure. There is set forth herein a method comprising: fabricating a second wafer built structure using a second wafer, the second wafer built structure defining a photonics structure and having a photonics device integrated into a photonics device dielectric stack of the second wafer based structure; and wafer scale bonding the second wafer built structure to a first wafer built structure.